Qualcomm today announced new chips for mobile and networking gadgets, including the new Snapdragon 805 processor supoports UltraHD resolutions, its fourth-Generation 3G/LTE multimode modem and RF transceiver chips along with the Qualcomm Internet Processor (IPQ) product line.
The next generation mobile processor of the Qualcomm Snapdragon 800 tier, the Qualcomm Snapdragon 805 processor, hs been designed to deliver the highest-quality mobile video, imaging and graphics at Ultra HD (4K) resolution, both on device and via Ultra HD TVs.
Featuring the new Adreno 420 GPU, with up to 40 percent more graphics processing power than its predecessor, the Snapdragon 805 processor is the first mobile processor to offer system-level Ultra HD support, 4K video capture and playback and enhanced dual camera Image Signal Processors (ISPs).
The Snapdragon 805 processor is featuring a Krait 450 quad-core mobile CPU running at speeds of up to 2.5 GHz per core. It also supports memory bandwidth of up to 25.6 GB/second. Ultra HD graphics are powered by the Adreno 420 GPU, which introduces support for hardware tessellation and geometry shaders, for 4K rendering.
Either the Qualcomm Gobi MDM9x25 or the Gobi MDM9x35 modems are integrated. The Gobi MDM9x25 chipset supports LTE carrier aggregation and LTE Category 4 with peak data rates of up to 150Mbps. Additionally, Qualcomm's 2-stream dual-band Qualcomm VIVE 802.11ac Wi-Fi echnology enables wireless 4K video streaming and other media-intensive applications. With a low-power PCIe interface to the QCA6174, tablets and high-end smartphones can take advantage of faster mobile Wi-Fi performance (over 600 Mbps).
The Snapdragon 805 also supports the Hollywood Quality Video (HQV) for video post processing and introduces hardware 4K HEVC (H.265) decoding for mobiles for low-power HD video playback.
Gpixel/s throughput camera support increases the camera's speed and imaging quality. And sensor processing with gyro integration enables image stabilization.
The Snapdragon 805 processor is sampling now and expected to be available in commercial devices by the first half of 2014.
Qualcomm fourth-generation 3G/LTE multimode solutions include the Qualcomm Gobi 9x35 modem chipset, and an RF transceiver chip, the Qualcomm WTR3925.
The Qualcomm Gobi 9x35 is the first announced cellular modem based on the 20 nm technology node with support for global carrier aggregation deployments up to 40 MHz for both LTE TDD and FDD Category 6 with download speeds of up to 300 Mbps. The Gobi 9x35 is backwards compatible and supports all other major cellular technologies, including DC-HSPA, EVDO Rev. B, CDMA 1x, GSM and TD-SCDMA. The Qualcomm WTR3925 is the first RF transceiver chip based on the 28 nm process, and is Qualcomm Technologies' first single-chip, carrier aggregation RF solution that supports all carrier aggregation band combinations approved by 3GPP. The WTR3925 pairs with the Gobi 9x35 chipset and the Qualcomm RF360 Front End Solution to enable a single-SKU LTE platform.
The Gobi 9x35 and WTR3925 are specifically designed to use less power and occupy less printed circuit board area and continue the trend towards tighter integration, smaller size and increased performance. The 40 MHz carrier aggregation capability of the Gobi 9x35, coupled with the carrier aggregation band support of the WTR3925, is engineered to allow network operators to combine their fragmented spectrum in all possible 3GPP-approved combinations of 5 MHz, 10 MHz, 15 MHz, and 20 MHz bandwidths to increase capacity and service more subscribers. The WTR3925 also incorporates the Qualcomm IZat location platform designed for delivery global location.
Qualcomm claims that the Gobi 9x35 modem and WTR3925 chipset deliver up to 2X faster LTE Advanced, CAT 6 up to 300 Mbps, along with dual carrier HSUPA and dual band multi-carrier HSPA+.
The company anticipates that the Gobi 9x35 and WTR3925 will begin sampling to its customers early next year.