Earlier this year, we learned that those in the US. and China will find a Snapdragon 820 SoC under the hood of their Samsung Galaxy S7. Elsewhere, the Exynos 8890 is expected to be be powering Sammy's new flagship smartphone. Packing Galaxy S units headed for the states with a Snapdragon chip has been the manufacturer's recent MO, except for a fluke this year. Because of the issue that the Snapdragon 810 chipset has with overheating, all Samsung Galaxy S6 units ended up with the Exynos 7420 SoC inside.
A posting found on Weibo from a Chinese tipster, seconds a rumor that we've heard before. The original speculation noted that the version of the Snapdragon 820 chip headed into the Galaxy S7 will be optimized for Samsung with better thermal management and lower power consumption. Because this enhanced Snapdragon 820 chip will run at a higher frequency than the regular version, a heat pipe will be added to help with the thermal control.
Дополнительный термопакет будет не лишним еще и из-за того, что Snapdragon 820 для Samsung будет работать на повышенных частотах.
The Weibo post adds that a new Geekbench test done on the Samsung Galaxy S7 powered with this enhanced Snapdragon 820 chip in tow, scored an impressive 2456 in the single-core test. The multi-core test also produced a tremendous score of 5423. If this test is legit, it would appear that U.S. and Chinese buyers of the phone shouldn't have any performance issues to worry about. Still, it would be prudent to take this story with the proverbial grain of salt.
We could see the Samsung Galaxy S7 unveiled on February 21st, the day before MWC opens in Barcelona, during a scheduled Samsung Unpacked event.